About ASE Technology Holding Co. Ltd.

ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. Founded in 1984 and based in Kaohsiung, Taiwan, ASEH is the leading provider of semiconductor manufacturing services in assembly and test.

Business Operations and Segments

The company operates through Packaging, Testing, EMS, and Others segments, with Packaging contributing the maximum revenue. ASEH's business model spans three primary areas:

Packaging Services

The packaging segment involves packaging bare semiconductors into completed semiconductors with improved electrical and thermal characteristics. Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 49%, 11%, 39%, and 1% of the total net revenues for Q2 2025, respectively.

Testing Services

The Testing Segment includes front-end engineering testing, wafer probing, and final testing services. The company offers a comprehensive suite of services including semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing, as well as integrated solutions for EMS (electronic manufacturing services) catering to computing, peripherals, communications, industrial, automotive, and server applications.

Electronic Manufacturing Services (EMS)

ASEH also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users. This includes wire bonding, lead frame and substrate-based packages, advanced packages, heterogeneous integration, and other test-related services.

Financial Performance

Recent Financial Results (Q2 2025)

ASE Technology Holding Co., Ltd. reported unaudited net revenues of NT$150,750 million for Q2 2025, an increase of 7.5% year-over-year and 1.8% sequentially. Net income attributable to shareholders for the quarter totaled NT$7,521 million, a decrease from NT$7,778 million in Q2 2024 and NT$7,554 million in Q1 2025. Basic earnings per share for the quarter were NT$1.74 (or US$0.111 per ADS), compared to NT$1.80 for Q2 2024 and NT$1.75 for Q1 2025.

Full Year 2024 Performance

For the full year of 2024, the Company reported unaudited net revenues of NT$595,410 million and net income attributable to shareholders of NT$32,483 million. In 2024, ASE Technology Holding achieved annual revenue of NT$595.41 billion, representing 2.32% growth.

Key Financial Metrics

- Q2 2025 Net Revenues: NT$150,750 million

- Q2 2025 Net Income: NT$7,521 million

- Full Year 2024 Net Revenues: NT$595,410 million

- Full Year 2024 Net Income: NT$32,483 million

- Market Capitalization: $22.33B (as of July 2025)

- Dividend Yield: 3.59% (trailing)

- Employee Count: 100,450 (as of June 30, 2025)

Global Operations and Manufacturing Footprint

With advanced technological capabilities and a global presence spanning Taiwan, China, South Korea, Japan, Singapore, Malaysia, Philippines, Vietnam, Mexico, and Tunisia, as well as the United States and Europe, ASEH has established a reputation for reliable, high-quality products and services. The company is actively expanding its operations, with ASE having officially launched its fifth plant in Penang. This new facility will significantly enhance the company's packaging and testing capabilities in the Bayan Lepas Free Industrial Zone, expanding the floor space of ASE's Malaysia facility from its current 1 million square feet to approximately 3.4 million square feet.

Innovation and Technology Leadership

ASE Technology continues to drive innovation in semiconductor packaging technology. Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced its Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV), propelling technology enablement for artificial intelligence (AI) and its pervasive impact on global life.

The company is also advancing co-packaged optics technology. ASE recently demonstrated a co-packaged optics (CPO) device that mounts multiple optical engines (OE) directly onto a substrate, enabling <5pJ/bit power consumption and significant bandwidth increases.

Market Position and Customer Base

ASEH maintains strong relationships with major semiconductor companies. Its top 10 customers contributed 78% of total net revenues in Q4 2024 and 71% in Q2 2025, compared to 74% in Q1 2025, indicating a stable yet slightly diversified customer base.

Capital Investment and Expansion

The company maintains significant capital expenditure programs to support growth. Equipment capital expenditures in Q2 2025 totaled US$992 million, with US$690 million allocated to packaging operations, US$251 million to testing operations, US$49 million to EMS operations, and US$2 million to interconnect materials operations and others. Capital expenditures in 2024 totaled US$1,876 million, distributed as US$957 million for packaging, US$815 million for testing, US$89 million for EMS, and US$15 million for interconnect materials and others.

ASE Technology Holding Co. Ltd. stands as the world's leading provider of semiconductor assembly and testing services, with a comprehensive portfolio spanning packaging, testing, and electronic manufacturing services. The company's strategic investments in advanced packaging technologies and global expansion position it well to capitalize on the growing demand for semiconductor solutions driven by AI, automotive, and 5G applications.